**FSI International Expands ZETA® ViPR Technology into NAND Flash Manufacturing**
Minneapolis, USA (March 24, 2009) — FSI International, Inc. (Nasdaq: FSI), the world’s leading supplier of wafer fabrication, cleaning, and surface treatment equipment for semiconductor manufacturing, announced today that a major memory manufacturer has integrated FSI’s ZETA® cleaning system with its proprietary ViPRTM all-wet ashless cleaning technology into NAND flash production.
This advancement highlights the growing recognition of FSI’s ZETA ViPR technology in advanced semiconductor processes. The technology is particularly effective in removing photoresist without the need for traditional ashing, which is commonly used in self-aligned polycide formation. A key benefit of this approach is its ability to eliminate the two-step ashing-cleaning process, replacing it with a single, more efficient step.
The customer confirmed that the ashless photoresist stripping method significantly reduces defects and improves overall process efficiency. By streamlining the production cycle, manufacturers can achieve faster throughput and lower operational costs.
“NAND technology continues to drive innovation in device size reduction,†said Don Mitchell, President and CEO of FSI. “Expanding ZETA ViPR into NAND manufacturing showcases the critical value of total wet removal in advanced processes. As devices become smaller, the importance of such technologies will only grow. We are proud to offer our customers real, tangible benefits through this differentiation process, including shorter cycle times, reduced capital expenditures, and lower operating costs.â€
ZETA ViPR technology stands out due to its ability to effectively remove residual metals after eliminating the ashing process. It also excels in self-aligned metal silicide applications, where it removes unreacted metal without damaging the delicate structures involved. This is especially beneficial when paired with advanced NiPt self-aligned metal silicide processes, allowing for lower annealing temperatures and reduced junction leakage, ultimately improving yield and performance.
By eliminating the need for ashing, ZETA ViPR not only saves time and cost but also avoids the damage and dopant loss typically associated with high-temperature ashing furnaces. This makes it an ideal solution for next-generation NAND flash manufacturing, where precision and reliability are essential.
As the demand for smaller, more powerful memory devices grows, FSI remains at the forefront of innovation, delivering cutting-edge solutions that meet the evolving needs of the semiconductor industry.
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