LED display application status, why import GM (mSSOP package)?
The history of LED development can be traced back to the 1970s. The earliest GaP, GaAsP homojunction red, yellow, and green LEDs with low luminous efficiency have begun to be used in LED, digital, and text displays. Since then, the use of LED has begun to enter a variety of applications, including aerospace, aircraft, automotive, industrial applications, communications, consumer products, etc., throughout the national economy departments and millions of households. LED application and development, from the LED display industry's growth trajectory, you can also get a glimpse of what happened. Including: 1. LED luminous efficiency increase, to achieve the same brightness, through the LED current value can be smaller, it will extend the life of the power supply. 2. In addition, the size of LED lamps is getting smaller and smaller. From the DIP (plug-in lamp) to the surface mount lamp (SMD), there are even S060 lamps on the market. This development process allows the LED display's dot pitch to be reduced, and it can also move from outdoor to indoor, so the overall display process design must also be refined. For current application specifications, outdoor screens are commonly used (see Figure 1): P10, P12, P16, P19, P20, P21, P22, P26, especially P10 is a common specification for outdoor advertising screens; indoor screens are commonly used (see Figure 2): P3, P3.75, P4, P5, some manufacturers can do P1.5, P2, today in the subway station (such as Beijing Sanyuanqiao station) can see the indoor advertising screen is widely used. The LED display industry has developed rapidly in terms of production technology. Display manufacturers have been unable to use the high homogenization and price competition strategies of past products to gain market share. In the face of various applications and market demands, such as ultra-compact screens or rental screens, the design must be made at a higher standard in order to face fierce market competition. Including the box structure requires beautiful appearance, the overall weight must be light and thin, allowing the user to assemble and disassemble on the site becomes simple, saving the assembly time; even some manufacturers directly data, power interface to do the junction between the box, box There is no wire connection between them, reducing the possibility of dust accumulation and reducing the occurrence of failure rates. Therefore, for the lighter and thinner box design, the market demand for driver IC packaging technology is also increasing. From the earliest SOP (aggregate product coded as GF) package, SSOP (growth product coded as GP) package, QFN package (aggregate product coded as GFN), to the current mSSOP (aggregate product coded GM) package, it can be found that LED It is an inevitable trend that the size of the driver IC is lightweight, which also challenges the ability of the driver IC manufacturer to do product design, and must expand the function to the limit in a limited chip area. A.GM (mSSOP) Package Replaces GP (SSOP) Package Advantage Lights drive a two-layer board scheme, the total cost of module production is reduced by 7% As far as the current outdoor LED advertising screen market is concerned, the P10/4 scanning standard is mainstream, and using GM-packaged LED driver ICs will reduce the use of one-layer driver versions compared to the traditional GP driver ICs; On the surface, the back of the foot is not intractable after cutting. It simplifies the overall production process and increases production capacity. The most important thing is that the total module production cost can be reduced by 7%. Smaller footprint, favorable PCB layout The GM package area is 37% smaller than the GP package area. Therefore, regardless of the LED display PCB design for the DIP or SMD type, LAYOUT is simpler and can also save the number of layers. Cooperate with LED lamp luminous efficiency, with the most suitable current value As mentioned earlier, the luminous efficiency of LED lamps has risen so that outdoor LED displays can achieve the same brightness as used in the past, and smaller currents can be used. According to the current market experience, most of the outdoor LED display application currents fall within 20mA±10%. For example, accumulation of MBI5120, MBI5124, MBI515x, and other GM packaging products have a maximum current set between 20~25mA, which is in line with the mainstream market demand. PIN pin design with GP package, easy to import program The function definition of the PIN pin of the GM package is the same as that of the GP package. Therefore, when the original GP package is converted into the GM package, only the original PCB board needs to be slightly modified to be perfectly replaced. B.GM (mSSOP) Package Replaces GFN (QFN) Package Advantage Improve the yield of LED display products and reduce the occurrence of cold and continuous tin When using the QFN package, the common problem is that the PIN pin, the thermal pad, and the PCB board pad of the QFN package are prone to false soldering or bad soldering between adjacent PIN pins, resulting in an increase in the defective rate. Relatively speaking, GM packaging has lower SMT process requirements, which can help reduce the production failure rate and reduce the cost of customer complaints. 12 Increased patch speed by 10% and rapid increase in production capacity The GM packaging speed is 10% faster than the QFN package, which helps increase overall production capacity. Reduce high-tech manpower requirements GM package testing and maintenance is easier than QFN, so only general technicians can operate it, reducing high-end labor costs and making resources more efficient. At present, the GM (mSSOP) package is available in the market for about half a year. For common questions when importing, the following summarizes the relevant SMT experience for manufacturers to refer to when importing, speed up the import speed: PCB related a. Confirm whether PCBPAD is oxidized and clean it with cleaning agent before going online b.If PCB is not vacuum packaged before baking c. Confirm board edge MARK d. The board needs AOI and X-RAY Steel mesh related a. The recommended thickness is 0.12mm b. The number of cleanings is recommended to be cleaned once every 3~5 times printing other a.BGA.CSP.QFP and other non-vacuum packaging IC if you have to remove the original packaging must be placed in the oven baking: 110 +/- 5 °C 24HR; b. Confirm and check the mounting pressure c. The furnace temperature plate must be used to obtain the furnace temperature curve before going online Miniaturization is the driving force behind the design of all consumer electronics products, and consumer electronics products are moving toward lightweight, micro, and development. The world’s first computer covers an area of ​​1,500 square feet and weighs 30 tons, and it has grown to the current PAD. “Big brick†portable mobile phones have developed to current smart phones; in response to LED display design orientation and overall market demand, historically We can see the past GP (SSOP) package instead of the GF (SOP) package, so we can boldly expect that the GM (mSSOP) package will also replace most GP (SSOP) packages. The introduction of a brand-new GM package represents an improvement in the manufacturing process of LED display screens and also demonstrates the progress in research and development capabilities. Whether it is replacing GM package with GM package or replacing QFN package, the quality of the product can be improved. It is believed that more and more GM experience will enable LED display production to enter the next era. Shenzhen Kaixuanye Technology Co., Ltd. , https://www.icoilne.com