LED flip chip hot heat Hebei related projects passed the acceptance
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The international technology cooperation project has cooperated with the Japan Bridge Manufacturing Co., Ltd. to research key technologies such as LED chip flip-bonding new technology, high-performance heat-dissipating substrate, and anisotropic conductive rubber preparation, and developed LED flip chip adhesive. The new process; the COB light source using the LED flip chip adhesive packaging process contains more than 30% of the chip in the same area than the COB light source in the positive package, and the total luminous flux is increased by more than 50%; the thermal conductivity of the special substrate developed has reached 386. W/mK greatly improved the heat dissipation performance; applied for one invention patent and obtained three utility model patents.
Through international scientific and technological cooperation, many technical problems such as LED flip chip bonding have been overcome, and a stable and effective cooperation mechanism has been established, forming a stable R&D team within the enterprise.
The project effectively solves the technical problems of poor thermal conductivity, poor conductivity, low light extraction efficiency, poor reliability, and a small number of chips per unit area that can be packaged in the domestic LED packaged chip packaging technology. After the LED flip chip bonding process matures, it will form a new technical route in the field of LED packaging. It is a major technological breakthrough and fills the blank of the domestic LED flip chip bonding process. The application of this technology will replace the formal bonding process on a large scale to realize the upgrading of LED packaging technology. 