Japan exhibits Mo substrate and MoCu substrate instead of LED sapphire substrate

At the "3rd New Generation Lighting Technology Exhibition" in Japan, PLANSEE Japan exhibited products such as molybdenum (Mo) substrates and molybdenum-copper (MoCu) substrates for replacing sapphire substrates embedded in LED structures.

It is understood that by replacing the Mo substrate or the MoCu substrate, the heat dissipation performance of the LED chip can be improved, and the LED chip can be improved in power and efficiency.

The GaN-based semiconductor crystal is epitaxially grown on the sapphire substrate, and then the Mo substrate or the MoCu substrate is pasted on the GaN-based semiconductor crystal. The sapphire substrate is then removed and cut into LED chips. The technology of replacing sapphire substrates with other substrates has been used for some blue LED chips. According to Plansee Japan, the use of Mo substrates is currently limited to UV LED chips. The use of the Laser Dicing method is slower than when an LED chip replaced with a Mo substrate or the like is cut into an LED chip.

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