Mouser Electronics sells Infineon XENSIV MEMS microphone with noise floor of only 25 dBA
On March 26, 2018, Mouser Electronics, a leading global distributor of semiconductors and electronic components, announced the availability of Infineon Technologies’ IM69D120 and IM69D130 XENSIV™ MEMS microphones. These high-performance, low-noise microphones are ideal for applications such as high-fidelity audio recording, voice user interfaces, active noise cancellation, and audio mode detection in surveillance systems.
The XENSIV MEMS microphones from Infineon, available through Mouser, are designed for applications requiring ultra-low self-noise, wide dynamic range, minimal distortion, and high acoustic overload points. Utilizing Infineon’s dual backplane MEMS technology, these microphones deliver highly linear signals across a dynamic range of up to 105 dB. The advanced design, similar to studio-grade condenser microphones, produces true differential signals, enhancing high-frequency immunity and improving overall audio processing performance. This technology also increases the acoustic overload point at 10% THD to 135 dB SPL, making it suitable for demanding environments.
Measuring 4 mm x 3 mm, these microphones boast an impressive noise floor of just 25 dBA (with a signal-to-noise ratio of 69 dBA). Even at a sound pressure level of 128 dB, the total harmonic distortion remains below 1%. To support flexible system designs, the IM69D120 is optimized for 16-bit systems, maintaining a consistent 69 dBA SNR, while the IM69D130 is tailored for 20-bit systems. Compared to conventional MEMS microphones, these models offer a 5 dB improvement in signal-to-noise ratio, effectively doubling the distance at which voice commands can be accurately captured. Additionally, their flat frequency response and tight manufacturing tolerances ensure excellent phase matching, making them an ideal choice for microphone array applications.
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